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EPC16UC88 Tech Specifications
Category | Memory - Configuration Proms for FPGAs | |
Manufacturer | Intel | |
Mounting Type | Surface Mount | |
Package / Case | 88-LFBGA | |
Surface Mount | YES | |
Operating Temperature | 0°C~70°C | |
Packaging | Tray | |
Series | EPC | |
JESD-609 Code | e1 | |
Part Status | Obsolete | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Number of Terminations | 88Terminations | |
ECCN Code | EAR99 | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
HTS Code | 8542.32.00.51 | |
Voltage - Supply | 3V~3.6V | |
Terminal Position | BOTTOM | |
Terminal Form | BALL | |
Peak Reflow Temperature (Cel) | 260 | |
Number of Functions | 1Function | |
Supply Voltage | 3.3V | |
Terminal Pitch | 0.8mm |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Base Part Number | EPC16 | |
JESD-30 Code | R-PBGA-B88 | |
Qualification Status | Not Qualified | |
Supply Voltage-Max (Vsup) | 3.6V | |
Power Supplies | 3.3V | |
Supply Voltage-Min (Vsup) | 3V | |
Programmable Type | In System Programmable | |
Memory Size | 16Mb | |
Operating Mode | SYNCHRONOUS | |
Clock Frequency | 66.7MHz | |
Supply Current-Max | 0.09mA | |
Organization | 1MX16 | |
Memory Width | 16 | |
Standby Current-Max | 0.00015A | |
Memory Density | 16777216 bit | |
Parallel/Serial | PARALLEL | |
Memory IC Type | CONFIGURATION MEMORY | |
Length | 11mm | |
Height Seated (Max) | 1.4mm | |
Width | 8mm | |
RoHS Status | Non-RoHS Compliant |
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EPC16UC88 Documents
Download datasheets and manufacturer documentation for EPC16UC88
- DatasheetsEnhanced Configuration (EPC) Devices Datasheet EPC Series, SRAM Devices 88-UBGA Pkg Info
- PCN Obsolescence/ EOLEPC/CS/CQ Device EOL 1/Jun/2017
- PCN Design/SpecificationMult Dev Substrate Material Chg 25/Aug/2017 Mult Dev Substrate Material REV 25/Aug/2017
- PCN PackagingAll Dev Pkg Chg 1/Aug/2018 Mult Dev Dessicant Chg 19/Jul/2019
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