EPC16UC88 Tech Specifications

Category Memory - Configuration Proms for FPGAs
Manufacturer Intel
Mounting Type Surface Mount
Package / Case 88-LFBGA
Surface Mount YES
Operating Temperature 0°C~70°C
Packaging Tray
Series EPC
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 88Terminations
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.32.00.51
Voltage - Supply 3V~3.6V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 3.3V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number EPC16
JESD-30 Code R-PBGA-B88
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Programmable Type In System Programmable
Memory Size 16Mb
Operating Mode SYNCHRONOUS
Clock Frequency 66.7MHz
Supply Current-Max 0.09mA
Organization 1MX16
Memory Width 16
Standby Current-Max 0.00015A
Memory Density 16777216 bit
Parallel/Serial PARALLEL
Memory IC Type CONFIGURATION MEMORY
Length 11mm
Height Seated (Max) 1.4mm
Width 8mm
RoHS Status Non-RoHS Compliant
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EPC16UC88 Documents

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