Intel EPC2TI32N Configuration Proms for FPGAs
32Terminations 1.6Mb
IN STOCK
: 20
Min. : 1
Mult. : 1
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EPC2TI32N Tech Specifications
| Category | Memory - Configuration Proms for FPGAs | |
| Manufacturer | Intel | |
| Mounting Type | Surface Mount | |
| Package / Case | 32-TQFP | |
| Surface Mount | YES | |
| Memory Types | FLASH | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Tray | |
| Series | EPC | |
| Published | 2016 | |
| JESD-609 Code | e3 | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 32Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Matte Tin (Sn) | |
| Additional Feature | IT CAN ALSO OPERATE AT 5V SUPPLY | |
| HTS Code | 8542.32.00.51 | |
| Voltage - Supply | 3V~3.6V 4.5V~5.5V | |
| Terminal Position | QUAD | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Supply Voltage | 3.3V | |
| Terminal Pitch | 0.8mm |
| Reach Compliance Code | compliant | |
| Frequency | 10MHz | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Base Part Number | EPC2 | |
| JESD-30 Code | S-PQFP-G32 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 3.6V | |
| Power Supplies | 3.3/5V | |
| Supply Voltage-Min (Vsup) | 3V | |
| Programmable Type | In System Programmable | |
| Memory Size | 1.6Mb | |
| Nominal Supply Current | 18mA | |
| Operating Mode | SYNCHRONOUS | |
| Access Time | 20 ns | |
| Organization | 1695680X1 | |
| Memory Width | 1 | |
| Standby Current-Max | 0.0001A | |
| Memory Density | 1695680 bit | |
| Parallel/Serial | SERIAL | |
| Max Junction Temperature (Tj) | 135°C | |
| Ambient Temperature Range High | 85°C | |
| Height | 1.2mm | |
| Length | 7mm | |
| Width | 7mm | |
| RoHS Status | RoHS Compliant |
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EPC2TI32N Documents
Download datasheets and manufacturer documentation for EPC2TI32N
- DatasheetsEnhanced Configuration (EPC) Devices Datasheet EPC Series, SRAM Devices 32TQFP Pkg Info
- PCN Obsolescence/ EOLEPC2/Cyclone/Stratix GX 13/Jun/2018
- PCN PackagingAll Dev Pkg Chg 1/Aug/2018 Mult Dev Dessicant Chg 19/Jul/2019
- TechnicalDrawingIntel-EPC2TI32N.pdf
- ConflictMineralStatementIntel-company-52.pdf
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