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EPM1270GF256C3 Tech Specifications

Category Embedded - CPLDs (Complex Programmable Logic Devices)
Manufacturer Intel
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Number of I/Os 212I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® II
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
ECCN Code 3A991
Terminal Finish TIN LEAD
Additional Feature YES
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 1.8V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number EPM1270
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.89V
Power Supplies 1.5/3.31.8V
Supply Voltage-Min (Vsup) 1.71V
Programmable Type In System Programmable
Propagation Delay 6.2 ns
Output Function MACROCELL
Number of Macro Cells 980Macro Cells
JTAG BST YES
Voltage Supply - Internal 1.71V~1.89V
Delay Time tpd(1) Max 6.2ns
Number of Logic Elements/Blocks 1270Logic Elements/Blocks
Length 17mm
Height Seated (Max) 2.2mm
Width 17mm
RoHS Status Non-RoHS Compliant
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