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EPM570F100C5N Tech Specifications

Category Embedded - CPLDs (Complex Programmable Logic Devices)
Manufacturer Intel
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 100-LBGA
Surface Mount YES
Number of I/Os 76I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® II
Published 2014
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 100Terminations
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature IT CAN ALSO OPERATE AT 3.3V
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 2.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number EPM570
JESD-30 Code S-PBGA-B100
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 1.5/3.32.5/3.3V
Supply Voltage-Min (Vsup) 2.375V
Programmable Type In System Programmable
Propagation Delay 8.7 ns
Output Function MACROCELL
Number of Macro Cells 440Macro Cells
JTAG BST YES
Voltage Supply - Internal 2.5V 3.3V
Delay Time tpd(1) Max 5.4ns
Number of Logic Elements/Blocks 570Logic Elements/Blocks
Length 11mm
Height Seated (Max) 1.7mm
Width 11mm
RoHS Status RoHS Compliant
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