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EPM570F256C3 Tech Specifications

Category Embedded - CPLDs (Complex Programmable Logic Devices)
Manufacturer Intel
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Number of I/Os 160I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® II
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature IT CAN ALSO OPERATE AT 3.3V
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 2.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number EPM570
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 1.5/3.32.5/3.3V
Supply Voltage-Min (Vsup) 2.375V
Programmable Type In System Programmable
Propagation Delay 5.4 ns
Output Function MACROCELL
Number of Macro Cells 440Macro Cells
JTAG BST YES
Voltage Supply - Internal 2.5V 3.3V
Delay Time tpd(1) Max 5.4ns
Number of Logic Elements/Blocks 570Logic Elements/Blocks
Length 17mm
Height Seated (Max) 2.2mm
Width 17mm
RoHS Status Non-RoHS Compliant
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