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EPM570F256C5 Tech Specifications

Category Embedded - CPLDs (Complex Programmable Logic Devices)
Manufacturer Intel
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Number of I/Os 160I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® II
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
ECCN Code EAR99
Terminal Finish TIN LEAD
Additional Feature IT CAN ALSO OPERATE AT 3.3V
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 2.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number EPM570
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 1.5/3.32.5/3.3V
Supply Voltage-Min (Vsup) 2.375V
Programmable Type In System Programmable
Propagation Delay 8.7 ns
Output Function MACROCELL
Number of Macro Cells 440Macro Cells
JTAG BST YES
Voltage Supply - Internal 2.5V 3.3V
Delay Time tpd(1) Max 5.4ns
Number of Logic Elements/Blocks 570Logic Elements/Blocks
Length 17mm
Height Seated (Max) 2.2mm
Width 17mm
RoHS Status Non-RoHS Compliant
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