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JS28F256M29EWHB Tech Specifications

Category Memory
Manufacturer Intel
Surface Mount YES
Number of Terminals 56Terminals
Package Description TSSOP, TSSOP56,.8,20
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Number of Words Code 16000000Words Codes
Package Body Material PLASTIC/EPOXY
Package Equivalence Code TSSOP56,.8,20
Operating Temperature-Min -40 °C
Reflow Temperature-Max (s) NOT SPECIFIED
Access Time-Max 110 ns
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number JS28F256M29EWHB
Number of Words 16777216 wordsWord
Supply Voltage-Nom (Vsup) 3 V
Package Code TSSOP
Package Shape RECTANGULAR
Manufacturer Micron Technology Inc
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Risk Rank 5.42
Part Package Code TSOP
JESD-609 Code e4
Pbfree Code Yes
ECCN Code 3A991.B.1.A
Type NOR TYPE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
HTS Code 8542.32.00.51
Subcategory Flash Memories
Technology CMOS
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 0.5 mm
Reach Compliance Code compliant
Pin Count 56
JESD-30 Code R-PDSO-G56
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Power Supplies 3/3.3 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.031 mA
Organization 16MX16
Seated Height-Max 1.2 mm
Memory Width 16
Standby Current-Max 0.00021 A
Memory Density 268435456 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 3 V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 256Sectors/Sizes
Sector Size 128K
Page Size 16/32 words
Ready/Busy YES
Common Flash Interface YES
Width 14 mm
Length 18.4 mm
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