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KU80386EXTB25 Tech Specifications

Category Embedded - Microprocessors
Manufacturer Intel
Mount Surface Mount
Package / Case QFP
Operating Temperature (Max.) 117°C
Operating Temperature (Min.) -40°C
Packaging Bulk
Published 1998
JESD-609 Code e0
Part Status Discontinued
Number of Terminations 132Terminations
ECCN Code 3A001.A.3
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 3.3V
Terminal Pitch 0.635mm
Frequency 25MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 132
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Voltage 3.3V
uPs/uCs/Peripheral ICs Type MICROPROCESSOR
Bit Size 32
Access Time 25 μs
Address Bus Width 26
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 16
Format FIXED POINT
Integrated Cache NO
RAM (words) 0
Number of Serial I/Os 3Serial I/Os
Number of External Interrupts 12External Interrupts
Number of DMA Channels 2DMA Channels
Length 24.13mm
Height Seated (Max) 4.57mm
Width 24.13mm
RoHS Status Non-RoHS Compliant
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