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- MYP1UPDB
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Mult. : 1

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MYP1UPDB Tech Specifications
| Category | Evaluation and Demonstration Boards and Kits | |
| Manufacturer | Intel | |
| Contact Plating | Lead, Tin | |
| RoHS | Compliant | |
| Factory Pack QuantityFactory Pack Quantity | 1 | |
| Part # Aliases | 99A2D8 | |
| Manufacturer | Intel | |
| Brand | Intel | |
| Packaging | Tape & Reel | |
| Tolerance | 1 % |
| Temperature Coefficient | 50 ppm/°C | |
| Resistance | 71.5 Ω | |
| Max Operating Temperature | 125 °C | |
| Min Operating Temperature | -55 °C | |
| Composition | Thin Film | |
| Subcategory | Development Tools | |
| Power Rating | 250 mW | |
| Product Type | Power Management IC Development Tools | |
| Product Category | Power Management IC Development Tools | |
| Radiation Hardening | No |
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