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TG80960JS25 Tech Specifications

Category Embedded - Microprocessors
Manufacturer Intel
Mount Surface Mount
Package / Case 132-QFP
Operating Temperature 0°C~100°C TC
Packaging Tray
Series i960
Published 2002
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 132Terminations
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 0.635mm
Frequency 25MHz
Pin Count 132
JESD-30 Code S-PQFP-G132
Power Supplies 3.33.3/5V
Voltage 3V
RAM Size 1kB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Supply Current-Max 185mA
Bit Size 32
Access Time 25 μs
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 3.3V
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RoHS Status Non-RoHS Compliant
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