EPM2210F324I4N Tech Specifications

Category Embedded - PLDs (Programmable Logic Device)
Manufacturer Intel
Surface Mount YES
Number of Terminals 324Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INTEL CORP
Package Description 19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324
Clock Frequency-Max 172.4 MHz
Number of I/O Lines 272I/O Lines
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA324,18X18,40
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
Supply Voltage-Nom 2.5 V
JESD-609 Code e1
ECCN Code 3A991.D
Terminal Finish TIN SILVER COPPER
Additional Feature IT CAN ALSO OPERATE AT 3.3V
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B324
Number of Outputs 272Outputs
Qualification Status Not Qualified
Propagation Delay 9.1 ns
Number of Inputs 272Inputs
Organization 0 DEDICATED INPUTS, 272 I/O
Seated Height-Max 2.2 mm
Programmable Logic Type FLASH PLD
Output Function MACROCELL
Number of Macro Cells 1700Macro Cells
JTAG BST YES
In-System Programmable YES
Length 19 mm
Width 19 mm
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