PF38F5060M0Y0B0 Tech Specifications

Category Specialized
Manufacturer Intel
Surface Mount YES
Number of Terminals 105Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer INTEL CORP
Part Package Code BGA
Package Description TFBGA, BGA105,9X12,32
Moisture Sensitivity Levels 3
Number of Words 33554432 wordsWord
Number of Words Code 32000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -30 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA105,9X12,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 1.8 V
JESD-609 Code e1
ECCN Code EAR99
Terminal Finish TIN SILVER COPPER
Additional Feature PSEUDO SRAM IS ORGANIZED AS 8M X 16
HTS Code 8542.32.00.71
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Pin Count 105
JESD-30 Code R-PBGA-B105
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.7 V
Operating Mode SYNCHRONOUS
Organization 32MX16
Seated Height-Max 1.2 mm
Memory Width 16
Standby Current-Max 0.00012 A
Memory Density 536870912 bit
Memory IC Type MEMORY CIRCUIT
Mixed Memory Type FLASH+PSRAM
Length 11 mm
Width 9 mm
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