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RD28F3204W30B70 Tech Specifications

Category Specialized
Manufacturer Intel
Surface Mount YES
Number of Terminals 80Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEL CORP
Part Package Code BGA
Package Description LFBGA,
Number of Words 2097152 wordsWord
Number of Words Code 2000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 1.8 V
ECCN Code EAR99
Additional Feature SRAM IS CONFIGURED AS 256K X 16
HTS Code 8542.32.00.71
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
Pin Count 80
JESD-30 Code R-PBGA-B80
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.9 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.7 V
Operating Mode SYNCHRONOUS
Organization 2MX16
Seated Height-Max 1.4 mm
Memory Width 16
Memory Density 33554432 bit
Memory IC Type MEMORY CIRCUIT
Length 14 mm
Width 8 mm
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