RD38F2030W0ZTQ0 Tech Specifications

Category Specialized
Manufacturer Intel
Surface Mount YES
Number of Terminals 88Terminals
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA88,8X12,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 1.8 V
Operating Temperature-Max 85 °C
Number of Words Code 4000000Words Codes
Number of Words 4194304 wordsWord
Access Time-Max 70 ns
Package Description TFBGA, BGA88,8X12,32
Part Package Code BGA
Ihs Manufacturer INTEL CORP
Part Life Cycle Code Obsolete
Rohs Code No
JESD-609 Code e0
Pbfree Code No
ECCN Code EAR99
Terminal Finish TIN LEAD
Additional Feature CONTAINS 16 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH
HTS Code 8542.32.00.71
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Pin Count 88
JESD-30 Code R-PBGA-B88
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.95 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.7 V
Operating Mode SYNCHRONOUS
Supply Current-Max 0.055 mA
Organization 4MX16
Seated Height-Max 1.2 mm
Memory Width 16
Standby Current-Max 0.000015 A
Memory Density 67108864 bit
Memory IC Type MEMORY CIRCUIT
Mixed Memory Type FLASH+SRAM
Width 8 mm
Length 10 mm
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