RD38F3040L0YTQ0 Tech Specifications

Category Specialized
Manufacturer Intel
Surface Mount YES
Number of Terminals 88Terminals
Supply Voltage-Nom (Vsup) 1.8 V
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Package Shape RECTANGULAR
Package Equivalence Code BGA88,8X12,32
Package Code TFBGA
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -25 °C
Operating Temperature-Max 85 °C
Number of Words Code 8000000Words Codes
Number of Words 8388608 wordsWord
Access Time-Max 85 ns
Package Description TFBGA, BGA88,8X12,32
Part Package Code BGA
Ihs Manufacturer INTEL CORP
Part Life Cycle Code Obsolete
Rohs Code No
JESD-609 Code e0
ECCN Code EAR99
Terminal Finish TIN LEAD
Additional Feature CONTAINS 32M BIT PSRAM
HTS Code 8542.32.00.71
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Pin Count 88
JESD-30 Code R-PBGA-B88
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.7 V
Operating Mode SYNCHRONOUS
Supply Current-Max 0.035 mA
Organization 8MX16
Seated Height-Max 1.2 mm
Memory Width 16
Standby Current-Max 0.0001 A
Memory Density 134217728 bit
Memory IC Type MEMORY CIRCUIT
Mixed Memory Type FLASH+PSRAM
Width 8 mm
Length 10 mm
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