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TD27C256-25 Tech Specifications

Category Memory
Manufacturer Intel
Surface Mount NO
Number of Terminals 28Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEL CORP
Package Description DIP-28
Access Time-Max 250 ns
Number of Words 32768 wordsWord
Number of Words Code 32000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC
Package Code DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Supply Voltage-Nom (Vsup) 5 V
JESD-609 Code e0
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.32.00.61
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
JESD-30 Code R-XDIP-T28
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.03 mA
Organization 32KX8
Output Characteristics 3-STATE
Memory Width 8
Memory Density 262144 bit
Parallel/Serial PARALLEL
I/O Type COMMON
Memory IC Type UVPROM
Programming Voltage 12.75 V
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TD27C256-25 Documents

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