Intersil Corporation QHX220ICSR Telecom Interface ICs
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QHX220ICSR Tech Specifications
| Category | Interface - Telecom | |
| Manufacturer | Intersil | |
| Surface Mount | YES | |
| Number of Terminals | 9Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTERSIL CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY |
| Supply Voltage-Nom | 1.8 V | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Pin Count | 9 | |
| JESD-30 Code | S-PBGA-B9 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | INDUSTRIAL | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Length | 1 mm | |
| Width | 1 mm |
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