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HX316LS9IB/8 Tech Specifications

Category Memory Cards
Manufacturer Kingston
ECCN (US) EAR99
HTS 8473.30.11.40
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 16Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 1600
Chip Configuration 512Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.28/1.425
Typical Operating Supply Voltage (V) 1.35/1.5
Maximum Operating Supply Voltage (V) 1.45/1.575
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Double
ECC Support No
Number of Ranks DualRank
Number of Chip Banks 8Chip Banks
CAS Latency 9
SPD EEPROM Support No
Standard Package Name DIMM
Supplier Package SODIMM
Mounting Socket
Package Height 30
Package Length 67.6
PCB changed 204
Lead Shape No Lead
Part Status Active
Pin Count 204
Organization 1Gx64
PLL No
Self Refresh No
Module Type 204SODIMM
RoHS Status Yes with exemptions
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HX316LS9IB/8 Documents

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