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- A015125-08-LT
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A015125-08-LT Tech Specifications
| Category | Thermal - Pads, Sheets | |
| Manufacturer | Laird | |
| Mounting Type | Through Hole | |
| Package / Case | TO-257-3 | |
| Supplier Device Package | TO-257 | |
| Package | Bulk | |
| Mfr | Microchip Technology | |
| Product Status | Active | |
| Unit Weight | 0.045285 oz | |
| Factory Pack QuantityFactory Pack Quantity | 1 | |
| Manufacturer | Laird Performance Materials | |
| Brand | Laird Performance Materials | |
| Series | - |
| Subcategory | Thermal Management | |
| Technology | Standard | |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | |
| Current - Reverse Leakage @ Vr | 10 µA @ 800 mV | |
| Voltage - Forward (Vf) (Max) @ If | 1.15 V @ 15 A | |
| Operating Temperature - Junction | -65°C ~ 150°C | |
| Voltage - DC Reverse (Vr) (Max) | 100 V | |
| Current - Average Rectified (Io) | 15A | |
| Product Type | Thermal Interface Products | |
| Capacitance @ Vr, F | 300pF @ 5V, 1MHz | |
| Reverse Recovery Time (trr) | 35 ns | |
| Product Category | Thermal Interface Products |
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