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LCMXO2280C-3FTN256C Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Lattice Semiconductor
Factory Lead Time 8 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LBGA
Number of Pins 256Pins
Memory Types SRAM
Number of I/Os 211I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MachXO
Published 2007
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
Termination SMD/SMT
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Additional Feature IT CAN ALSO OPERATE AT 2.5V AND 3.3V
HTS Code 8542.39.00.01
Voltage - Supply 1.71V~3.465V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.8V
Terminal Pitch 1mm
Frequency 420MHz
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number LCMXO2280
Pin Count 256
Number of Outputs 211Outputs
Operating Supply Voltage 3.3V
Operating Supply Current 23mA
Propagation Delay 5.1 ns
Turn On Delay Time 5.1 ns
Programmable Logic Type FLASH PLD
Number of Logic Elements/Cells 2280Logic Elements/Cells
Total RAM Bits 28262
Number of LABs/CLBs 285LABs/CLBs
Output Function MACROCELL
Number of Macro Cells 1140Macro Cells
Number of Dedicated Inputs 7Dedicated Inputs
Length 17mm
Height Seated (Max) 1.55mm
Width 17mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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LCMXO2280C-3FTN256C Documents

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