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MX25L3255EXDI-10G Tech Specifications

Category Memory
Manufacturer Macronix
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 24-TBGA, CSPBGA
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tray
Series MXSMIO™
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 24Terminations
Additional Feature CAN BE ORGNISED AS 32 MBIT X 1; 5 X 5 BALL ARRAY
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 24
JESD-30 Code R-PBGA-B24
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.7V
Interface SPI, Serial
Memory Size 32Mb 4M x 8
Operating Mode SYNCHRONOUS
Clock Frequency 104MHz
Memory Format FLASH
Memory Interface SPI
Organization 8MX4
Memory Width 4
Write Cycle Time - Word, Page 300μs, 5ms
Memory Density 33554432 bit
Programming Voltage 2.7V
Alternate Memory Width 2
Length 8mm
Height Seated (Max) 1.2mm
Width 6mm
RoHS Status ROHS3 Compliant
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MX25L3255EXDI-10G Documents

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