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- MAX2828ETN-D
Original MAX2828ETN-D
IN STOCK
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Mult. : 1
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MAX2828ETN-D Tech Specifications
| Category | Fixed Inductors | |
| Manufacturer | Original | |
| Mounting Type | Surface Mount | |
| Surface Mount | YES | |
| Contact Shape | Square | |
| Number of Terminals | 56Terminals | |
| Voltage, Rating | -- | |
| Mated Stacking Heights | 4.5mm | |
| Contact Materials | Copper Alloy | |
| Contact Finish Mating | Tin | |
| Insulation Materials | Polyphenylene Sulfide (PPS), Glass Filled | |
| Package Description | HVQCCN, | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Package Body Material | UNSPECIFIED | |
| Operating Temperature-Min | -40 °C | |
| Supply Voltage-Nom | 2.7 V | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | MAX2828ETN+D | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Manufacturer | Maxim Integrated Products | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MAXIM INTEGRATED PRODUCTS INC | |
| Risk Rank | 5.6 | |
| Samacsys Description | Single-/Dual-Band 802.11a/b/g World-Band Transceiver ICs | |
| Operating Temperature | -40°C ~ 85°C | |
| Series | IL-WX | |
| Packaging | Bulk | |
| Pbfree Code | Yes | |
| Part Status | Active | |
| Termination | Solder | |
| Connector Type | Receptacle |
| Number of Positions | 10Positions | |
| Applications | General Purpose | |
| Number of Rows | 2Rows | |
| HTS Code | 8542.39.00.01 | |
| Fastening Type | Push-Pull | |
| Contact Type | Forked | |
| Technology | BICMOS | |
| Terminal Position | QUAD | |
| Terminal Form | NO LEAD | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Ingress Protection | -- | |
| Terminal Pitch | 0.5 mm | |
| Insulation Height | 0.128 (3.25mm) | |
| Style | Board to Board | |
| Number of Positions Loaded | All | |
| Reach Compliance Code | unknown | |
| Current Rating | 0.5A | |
| Pitch - Mating | 0.031 (0.80mm) | |
| Insulation Color | Black | |
| JESD-30 Code | S-XQCC-N56 | |
| Row Spacing - Mating | 0.049 (1.25mm) | |
| Contact Length - Post | -- | |
| Contact Finish - Post | -- | |
| Temperature Grade | INDUSTRIAL | |
| Seated Height-Max | 0.8 mm | |
| Telecom IC Type | SUPPORT CIRCUIT | |
| Features | Solder Retention | |
| Width | 8 mm | |
| Length | 8 mm | |
| Contact Finish Thickness - Mating | -- | |
| Contact Finish Thickness - Post | -- | |
| Material Flammability Rating | UL94 V-0 |
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