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- MAX2055EUP D
Maxim Integrated MAX2055EUP D RF Misc ICs and Modules
30MHz~300MHz 5V 20-TSSOP (0.173, 4.40mm Width) Exposed Pad
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MAX2055EUP D Tech Specifications
| Category | RF Misc ICs and Modules | |
| Manufacturer | Original | |
| Factory Lead Time | 6 Weeks | |
| Surface Mount | YES | |
| Package / Case | 20-TSSOP (0.173, 4.40mm Width) Exposed Pad | |
| Mounting Type | Surface Mount | |
| Weight | 190.990737mg | |
| Published | 2003 | |
| Packaging | Tube | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 20Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Matte Tin (Sn) | |
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -40°C |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Supply Voltage | 5V | |
| Frequency | 30MHz~300MHz | |
| Base Part Number | MAX2055 | |
| JESD-30 Code | R-PDSO-G20 | |
| Function | ADC Driver/Amplifier | |
| Temperature Grade | INDUSTRIAL | |
| Number of Bits | 5Bits | |
| Telecom IC Type | BASEBAND CIRCUIT | |
| RF Type | Cellular, ATE, PHS/PAS | |
| Secondary Attributes | 40dBm Output IP3 | |
| Width | 4.4mm | |
| Height Seated (Max) | 1.1mm | |
| RoHS Status | ROHS3 Compliant | |
| Radiation Hardening | No | |
| Lead Free | Lead Free |
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MAX2055EUP D Documents
Download datasheets and manufacturer documentation for MAX2055EUP D
- Application NotesThe IP3 Specification - Demystified Optimize the Buffer Amplifier/ADC Connection General Layout Guidelines for RF and Mixed-Signal PCBs Dynamic Performance Requirements for High-Performance ADCs and RF Components in Digital Receiver Applications
- DatasheetsMAX2055
- ConflictMineralStatementMaxim-Integrated-company-65.pdf
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