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24LC64-I/PG Tech Specifications

Category Memory
Manufacturer Microchip
Surface Mount NO
Number of Terminals 8Terminals
Package Description DIP, DIP8,.3
Package Style IN-LINE
Number of Words Code 8000Words Codes
Package Body Material PLASTIC/EPOXY
Package Equivalence Code DIP8,.3
Operating Temperature-Min -40 °C
Reflow Temperature-Max (s) NOT SPECIFIED
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number 24LC64-I/PG
Clock Frequency-Max (fCLK) 0.4 MHz
Number of Words 8192 wordsWord
Supply Voltage-Nom (Vsup) 5 V
Package Code DIP
Package Shape RECTANGULAR
Manufacturer Microchip Technology Inc
Part Life Cycle Code Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC
Risk Rank 5.21
Part Package Code DIP
JESD-609 Code e3
Pbfree Code Yes
ECCN Code EAR99
Terminal Finish Matte Tin (Sn) - annealed
HTS Code 8542.32.00.51
Subcategory EEPROMs
Technology CMOS
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code compliant
Pin Count 8
JESD-30 Code R-PDIP-T8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Power Supplies 3/5 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.5 V
Operating Mode SYNCHRONOUS
Supply Current-Max 0.003 mA
Organization 8KX8
Seated Height-Max 5.334 mm
Memory Width 8
Standby Current-Max 0.000001 A
Memory Density 65536 bit
Parallel/Serial SERIAL
Memory IC Type EEPROM
Serial Bus Type I2C
Endurance 1000000 Write/Erase Cycles
Write Cycle Time-Max (tWC) 5 ms
Data Retention Time-Min 200
Write Protection HARDWARE
I2C Control Byte 1010DDDR
Width 7.62 mm
Length 9.271 mm
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