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93LC66B-I/PG Tech Specifications

Category Memory
Manufacturer Microchip
Surface Mount NO
Number of Terminals 8Terminals
Part Package Code DIP
Risk Rank 5.13
Ihs Manufacturer MICROCHIP TECHNOLOGY INC
Part Life Cycle Code Active
Manufacturer Microchip Technology Inc
Package Shape RECTANGULAR
Package Code DIP
Supply Voltage-Nom (Vsup) 2.5 V
Number of Words 256 wordsWord
Clock Frequency-Max (fCLK) 1 MHz
Manufacturer Part Number 93LC66B-I/PG
Rohs Code Yes
Operating Temperature-Max 85 °C
Reflow Temperature-Max (s) NOT SPECIFIED
Operating Temperature-Min -40 °C
Package Equivalence Code DIP8,.3
Package Body Material PLASTIC/EPOXY
Number of Words Code 256Words Codes
Package Style IN-LINE
Package Description DIP, DIP8,.3
JESD-609 Code e3
Pbfree Code Yes
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
HTS Code 8542.32.00.51
Subcategory EEPROMs
Technology CMOS
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code compliant
Pin Count 8
JESD-30 Code R-PDIP-T8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Power Supplies 3/5 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 1.8 V
Operating Mode SYNCHRONOUS
Supply Current-Max 0.002 mA
Organization 256X16
Seated Height-Max 5.33 mm
Memory Width 16
Standby Current-Max 0.000001 A
Memory Density 4096 bit
Parallel/Serial SERIAL
Memory IC Type EEPROM
Serial Bus Type MICROWIRE
Endurance 1000000 Write/Erase Cycles
Write Cycle Time-Max (tWC) 6 ms
Data Retention Time-Min 200
Write Protection SOFTWARE
Length 9.27 mm
Width 7.62 mm
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