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AC89D55A Tech Specifications

Category Evaluation Boards - Expansion Boards, Daughter Cards
Manufacturer Microchip
Mounting Type Panel Mount
Mounting Feature Bulkhead - Front Side Nut
Shell Material Aluminum
Insert Material Thermoplastic
Backshell Material, Plating -
Voltage, Rating -
Package Bulk
Primary Material Metal
Base Product Number TVS07RF
Mfr Amphenol Aerospace Operations
Product Status Active
Contact Materials Copper Alloy
Contact Finish Mating Gold
For Use With MCU XPRO boards
Factory Pack QuantityFactory Pack Quantity 1
Manufacturer Microchip
Brand Microchip Technology
Operating Temperature -65°C ~ 200°C
Series MIL-DTL-38999 Series III, Tri-Start™ TV
Termination Crimp
Connector Type Receptacle, Male Pins
Type -
Number of Positions 43Positions
Color Silver
Applications Aviation, Marine, Military
Fastening Type Threaded
Subcategory Development Tools
Current Rating (Amps) -
Orientation A
Shielding Shielded
Ingress Protection Environment Resistant
Shell Finish Electroless Nickel
Shell Size - Insert 25-43
Function -
Shell Size, MIL -
Cable Opening -
Utilized IC / Part AC89D55A
Product Type Development Boards & Kits - Other Processors
Core Architecture -
Contents Board(s)
Platform Xplained Pro
Product Evaluation Kits
Features -
Kit Contents T9-XPRO Board with XPRO Female Connector
Product Category Development Boards & Kits - Other Processors
Contact Finish Thickness - Mating 100.0µin (2.54µm)
Material Flammability Rating -
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