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- PAC1953T-E/4MXVAO
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PAC1953T-E/4MXVAO Tech Specifications
| Category | PMIC - Current Regulation/Management | |
| Manufacturer | Microchip | |
| Mounting Type | Panel Mount, Through Hole, Right Angle | |
| Package / Case | 16-VFQFN Exposed Pad | |
| Supplier Device Package | 16-VQFN (3x3) | |
| Housing Material | Diallyl Phthalate (DAP), Glass Filled | |
| Shell Material, Finish | -- | |
| Lead Free Status / RoHS Status | -- | |
| Voltage, Rating | -- | |
| Contact Materials | Copper Alloy | |
| Qualification | AEC-Q100 | |
| Factory Pack QuantityFactory Pack Quantity | 3300 | |
| Manufacturer | Microchip | |
| Brand | Microchip Technology | |
| RoHS | Details | |
| Package | Tape & Reel (TR) | |
| Mfr | Microchip Technology | |
| Product Status | Active | |
| Voltage-Input | 2.7V ~ 5.5V | |
| Maximum Operating Temperature | + 125 C | |
| Supply Voltage-Max | 5.5 V | |
| Minimum Operating Temperature | - 40 C | |
| Supply Voltage-Min | 2.7 V | |
| Mounting Styles | SMD/SMT | |
| Operating Temperature | -55°C ~ 150°C | |
| Series | MDB | |
| Packaging | -- |
| Part Status | Active | |
| Termination | Solder | |
| Connector Type | Plug, Male Pins | |
| Number of Positions | 51Positions | |
| Color | -- | |
| Number of Rows | 3Rows | |
| Contact Type | Signal | |
| Ingress Protection | -- | |
| Current Rating | 3A | |
| Contact Finish | Gold | |
| Function | Current Monitor | |
| Wire Gauge | -- | |
| Flange Feature | Housing/Shell (Unthreaded) | |
| Operating Supply Current | 395 uA | |
| Connector Style | D-Type, Micro-D | |
| Current - Output | 100mA | |
| Accuracy | ±1% | |
| Contact Form | -- | |
| Shell Size, Connector Layout | 0.050 Pitch x 0.100 Row to Row | |
| Sensing Method | High-Side | |
| Backset Spacing | -- | |
| Product | Power Monitors | |
| Features | -- | |
| Product Category | Microchip Technology | |
| Contact Finish Thickness | -- | |
| Material Flammability Rating | -- |
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