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23LCV512T-I/ST Tech Specifications

Category Memory
Manufacturer Microchip
Factory Lead Time 6 Weeks
Mounting Type Surface Mount
Package / Case 8-TSSOP (0.173, 4.40mm Width)
Surface Mount YES
Memory Types Non-Volatile
Usage Level Automotive grade
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Published 2012
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8Terminations
Terminal Finish Matte Tin (Sn) - annealed
Voltage - Supply 2.5V~5.5V
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number 23LCV512
JESD-30 Code R-PDSO-G8
Supply Voltage-Max (Vsup) 5.5V
Supply Voltage-Min (Vsup) 2.5V
Interface SPI, Serial
Memory Size 512Kb 64K x 8
Operating Mode SYNCHRONOUS
Clock Frequency 20MHz
Memory Format NVSRAM
Memory Interface SPI - Dual I/O
Organization 64KX8
Memory Width 8
Memory Density 524288 bit
Screening Level TS 16949
Length 4.4mm
Height Seated (Max) 1.2mm
Width 3mm
RoHS Status ROHS3 Compliant
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23LCV512T-I/ST Documents

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