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- 24LC02BT-I/SN
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24LC02BT-I/SN Tech Specifications
Category | Memory | |
Manufacturer | Microchip | |
Factory Lead Time | 6 Weeks | |
Contact Plating | Tin | |
Mount | Surface Mount | |
Mounting Type | Surface Mount | |
Package / Case | 8-SOIC (0.154, 3.90mm Width) | |
Number of Pins | 8Pins | |
Memory Types | Non-Volatile | |
Operating Temperature | -40°C~85°C TA | |
Packaging | Tape & Reel (TR) | |
Published | 1999 | |
JESD-609 Code | e3 | |
Pbfree Code | yes | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Number of Terminations | 8Terminations | |
ECCN Code | EAR99 | |
Additional Feature | 1000000 ERASE/WRITE CYCLES, HARDWARE WRITE PROTECT, DATA RETENTION > 200 YEARS | |
Voltage - Supply | 2.5V~5.5V | |
Terminal Position | DUAL | |
Peak Reflow Temperature (Cel) | 260 | |
Number of Functions | 1Function | |
Supply Voltage | 5V | |
Terminal Pitch | 1.27mm | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Base Part Number | 24LC02B | |
Pin Count | 8 |
Supply Voltage-Max (Vsup) | 5.5V | |
Power Supplies | 3/5V | |
Supply Voltage-Min (Vsup) | 2.5V | |
Interface | 2-Wire, I2C, Serial | |
Memory Size | 2Kb 256 x 8 | |
Nominal Supply Current | 3mA | |
Clock Frequency | 400kHz | |
Access Time | 900ns | |
Memory Format | EEPROM | |
Memory Interface | I2C | |
Output Characteristics | OPEN-DRAIN | |
Write Cycle Time - Word, Page | 5ms | |
Density | 2 kb | |
Standby Current-Max | 0.000001A | |
Serial Bus Type | I2C | |
Endurance | 1000000 Write/Erase Cycles | |
Write Cycle Time-Max (tWC) | 5ms | |
Data Retention Time-Min | 200 | |
Write Protection | HARDWARE | |
I2C Control Byte | 1010XXXR | |
Height | 1.5mm | |
Length | 4.9mm | |
Width | 3.9mm | |
REACH SVHC | No SVHC | |
Radiation Hardening | No | |
RoHS Status | ROHS3 Compliant | |
Lead Free | Lead Free |
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24LC02BT-I/SN Documents
Download datasheets and manufacturer documentation for 24LC02BT-I/SN
- Datasheets24AA02, 24LC02B, 24FC02
- PCN Design/SpecificationBond Wire 07/Nov/2016 24AA02/24LC02B/24FC02 DS 19/Dec/2018
- PCN Assembly/OriginMult Dev Assembly 20/Dec/2018
- PCN PackagingPacking Changes 10/Oct/2016
- ConflictMineralStatementMicrochip-company-68.pdf
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