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- 25LC1024T-I/SM
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25LC1024T-I/SM Tech Specifications
Category | Memory | |
Manufacturer | Microchip | |
Factory Lead Time | 5 Weeks | |
Contact Plating | Tin | |
Mount | Surface Mount | |
Mounting Type | Surface Mount | |
Package / Case | 8-SOIC (0.209, 5.30mm Width) | |
Number of Pins | 8Pins | |
Supplier Device Package | 8-SOIJ | |
Memory Types | Non-Volatile | |
Operating Temperature | -40°C~85°C TA | |
Packaging | Tape & Reel (TR) | |
Published | 2007 | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Max Operating Temperature | 85°C | |
Min Operating Temperature | -40°C | |
Voltage - Supply | 2.5V~5.5V |
Frequency | 10MHz | |
Base Part Number | 25LC1024 | |
Interface | SPI, Serial | |
Max Supply Voltage | 5.5V | |
Min Supply Voltage | 2.5V | |
Memory Size | 1Mb 128K x 8 | |
Nominal Supply Current | 10mA | |
Clock Frequency | 20MHz | |
Access Time | 50 ns | |
Memory Format | EEPROM | |
Memory Interface | SPI | |
Write Cycle Time - Word, Page | 6ms | |
Density | 1 Mb | |
Max Frequency | 20MHz | |
Radiation Hardening | No | |
RoHS Status | ROHS3 Compliant | |
Lead Free | Lead Free |
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25LC1024T-I/SM Documents
Download datasheets and manufacturer documentation for 25LC1024T-I/SM
- Datasheets25LC1024
- PCN Design/SpecificationBond Wire Qualification 13/Jun/2016 Bond Wire 18/Oct/2016
- PCN PackagingPacking Changes 10/Oct/2016
- PCN Assembly/Origin8L SOIJ Package/Plating 31/Jul/2013
- ConflictMineralStatementMicrochip-company-68.pdf
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