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- 93C56C-I/MS
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93C56C-I/MS Tech Specifications
| Category | Memory | |
| Manufacturer | Microchip | |
| Factory Lead Time | 7 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | |
| Number of Pins | 8Pins | |
| Memory Types | Non-Volatile | |
| Operating Temperature | -40°C~85°C TA | |
| Packaging | Tube | |
| Published | 2008 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 8Terminations | |
| ECCN Code | EAR99 | |
| Voltage - Supply | 4.5V~5.5V | |
| Terminal Position | DUAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Supply Voltage | 5V | |
| Terminal Pitch | 0.65mm | |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | 93C56C | |
| Pin Count | 8 | |
| Operating Supply Voltage | 5V | |
| Power Supplies | 5V | |
| Interface | Serial | |
| Memory Size | 2Kb 256 x 8 128 x 16 | |
| Nominal Supply Current | 2mA | |
| Clock Frequency | 3MHz | |
| Access Time | 200 ns | |
| Memory Format | EEPROM | |
| Memory Interface | SPI | |
| Write Cycle Time - Word, Page | 2ms | |
| Density | 2 kb | |
| Standby Current-Max | 0.000001A | |
| Serial Bus Type | MICROWIRE | |
| Endurance | 1000000 Write/Erase Cycles | |
| Write Cycle Time-Max (tWC) | 2ms | |
| Data Retention Time-Min | 200 | |
| Write Protection | SOFTWARE | |
| Height | 950μm | |
| Length | 3mm | |
| Width | 3mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
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93C56C-I/MS Documents
Download datasheets and manufacturer documentation for 93C56C-I/MS
- Datasheets93(AA,LC,C)56x MS-Microchip-datasheet-11051705.pdf MS-Microchip-datasheet-1282.pdf MS-Microchip-datasheet-9609725.pdf 93C56C-I-MS-Microchip-datasheet-17371814.pdf 93C56C-I-MS-Microchip-datasheet-8329049.pdf
- PCN Design/SpecificationBond Wire Qualification 08/Jun/2016
- PCN Assembly/OriginMult Devices 26/Jun/2018
- PCN PackagingPacking Changes 10/Oct/2016
- ConflictMineralStatementMicrochip-company-68.pdf
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