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- 93C66AT-I/MC
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93C66AT-I/MC Tech Specifications
| Category | Memory | |
| Manufacturer | Microchip | |
| Factory Lead Time | 6 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-VFDFN Exposed Pad | |
| Number of Pins | 8Pins | |
| Memory Types | Non-Volatile | |
| Operating Temperature | -40°C~85°C TA | |
| Packaging | Tape & Reel (TR) | |
| Published | 2008 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 8Terminations | |
| ECCN Code | EAR99 | |
| Voltage - Supply | 4.5V~5.5V | |
| Terminal Position | DUAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Supply Voltage | 5V | |
| Terminal Pitch | 0.65mm | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Base Part Number | 93C66A |
| Pin Count | 8 | |
| Operating Supply Voltage | 5V | |
| Power Supplies | 5V | |
| Interface | Serial | |
| Memory Size | 4Kb 512 x 8 | |
| Nominal Supply Current | 2mA | |
| Clock Frequency | 2MHz | |
| Access Time | 250 ns | |
| Memory Format | EEPROM | |
| Memory Interface | SPI | |
| Memory Width | 8 | |
| Write Cycle Time - Word, Page | 2ms | |
| Density | 4 kb | |
| Standby Current-Max | 0.000001A | |
| Serial Bus Type | MICROWIRE | |
| Endurance | 1000000 Write/Erase Cycles | |
| Write Cycle Time-Max (tWC) | 2ms | |
| Data Retention Time-Min | 200 | |
| Write Protection | SOFTWARE | |
| Length | 3mm | |
| Height Seated (Max) | 1mm | |
| Width | 2.9mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
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93C66AT-I/MC Documents
Download datasheets and manufacturer documentation for 93C66AT-I/MC
- Datasheets93AA66x, 93LC66x, 93C66x MC-Microchip-datasheet-11051649.pdf MC-Microchip-datasheet-663.pdf MC-Microchip-datasheet-204.pdf 93C66AT-I-MC-Microchip-datasheet-17371814.pdf 93C66AT-I-MC-Microchip-datasheet-5392833.pdf
- PCN Assembly/OriginBond Wire 22/May/2019
- PCN PackagingPacking Changes 10/Oct/2016 MBB/Label Chgs 16/Nov/2018
- ConflictMineralStatementMicrochip-company-68.pdf
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