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A2F200M3F-1FG484I Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Microchip
Package / Case FPBGA-484
Supplier Device Package 484-FPBGA (23x23)
RoHS N
Mounting Styles SMD/SMT
Core ARM Cortex M3
Maximum Clock Frequency 100 MHz
L1 Cache Instruction Memory -
L1 Cache Data Memory -
Data RAM Size 64 kB
Number of Logic Elements 2000 LELogic Element
Number of I/Os 161 I/OI/O
Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 100 C
Moisture Sensitive Yes
Number of Logic Array Blocks - LABs -Logic Array Blocks - LAB
Factory Pack QuantityFactory Pack Quantity 60
Tradename SmartFusion
Package Tray
Base Product Number A2F200
Mfr Microchip Technology
Product Status Active
Packaging Tray
Series A2F200
Operating Temperature -40°C ~ 100°C (TJ)
Operating Supply Current 1 mA
Speed 100MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Program Memory Size 256 kB
Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART
Architecture MCU, FPGA
Number of Gates 200000Gates
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Number of Cores 1 CoreCore
Flash Size 256KB
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