A3P060-FGG144I Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Microchip
Package / Case FBGA-144
Mounting Type Surface Mount
Surface Mount YES
Supplier Device Package 144-FPBGA (13x13)
Number of Terminals 144Terminals
RoHS Details
Number of Logic Elements 660 LELogic Element
Number of I/Os 96 I/OI/O
Supply Voltage-Min 1.425 V
Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 85 C
Mounting Styles SMD/SMT
Maximum Operating Frequency 231 MHz
Moisture Sensitive Yes
Number of Logic Array Blocks - LABs -Logic Array Blocks - LAB
Factory Pack QuantityFactory Pack Quantity 1
Total Memory 18432 bit
Tradename ProASIC3
Supply Voltage-Max 1.575 V
Package Tray
Base Product Number A3P060
Mfr Microchip Technology
Product Status Active
Package Description LBGA,
Package Style GRID ARRAY, LOW PROFILE
Moisture Sensitivity Levels 3
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -40 °C
Supply Voltage-Nom 1.5 V
Reflow Temperature-Max (s) 40
Operating Temperature-Max 100 °C
Rohs Code Yes
Manufacturer Part Number A3P060-FGG144I
Clock Frequency-Max 350 MHz
Package Code LBGA
Package Shape SQUARE
Part Life Cycle Code Active
Ihs Manufacturer MICROSEMI CORP
Risk Rank 5.22
Series A3P060
Packaging Tray
Operating Temperature -40°C ~ 100°C (TJ)
JESD-609 Code e1
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Technology CMOS
Voltage - Supply 1.425V ~ 1.575V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Terminal Pitch 1 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B144
Qualification Status Not Qualified
Operating Supply Voltage 1.5 V
Temperature Grade INDUSTRIAL
Operating Supply Current 15 mA
Organization 1536 CLBS, 60000 GATES
Seated Height-Max 1.55 mm
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits 18432
Number of Gates 60000Gates
Speed Grade STD
Number of CLBs 1536CLBs
Number of Equivalent Gates 60000Equivalent Gates
Height 1.05 mm
Length 13 mm
Width 13 mm
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