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A3P1000-FGG256M Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Microchip
Package / Case FBGA-256
Mounting Type Surface Mount
Supplier Device Package 256-FBGA (17x17)
Shipping Restrictions This product may require additional documentation to export from the United States.
Number of Logic Elements 11000 LELogic Element
Number of I/Os 177 I/OI/O
Supply Voltage-Min 1.5 V
Minimum Operating Temperature 0 C
Maximum Operating Temperature + 85 C
Mounting Styles SMD/SMT
Distributed RAM 144 kbit
Embedded Block RAM - EBR 144 kbit
Maximum Operating Frequency 350 MHz
Number of Logic Array Blocks - LABs -Logic Array Blocks - LAB
Factory Pack QuantityFactory Pack Quantity 90
Total Memory 1 kbit
Tradename ProASIC3
Supply Voltage-Max 1.5 V
Package Tray
Base Product Number A3P1000
Mfr Microchip Technology
Product Status Active
Series A3P1000
Packaging Tray
Operating Temperature -55°C ~ 125°C (TJ)
Voltage - Supply 1.14V ~ 1.575V
Operating Supply Voltage 1.5 V
Operating Supply Current 8 mA
Data Rate 700 Mb/s
Total RAM Bits 147456
Number of Gates 1000000Gates
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