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- AT89C51RC2-SLSUM
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AT89C51RC2-SLSUM Tech Specifications
Category | Embedded - Microcontrollers | |
Manufacturer | Microchip | |
Factory Lead Time | 6 Weeks | |
Contact Plating | Tin | |
Mount | Surface Mount | |
Mounting Type | Surface Mount | |
Package / Case | 44-LCC (J-Lead) | |
Number of Pins | 44Pins | |
Number of I/Os | 32I/Os | |
Watchdog Timers | Yes | |
Operating Temperature | -40°C~85°C TA | |
Packaging | Tube | |
Series | 89C | |
Published | 1997 | |
JESD-609 Code | e3 | |
Pbfree Code | yes | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Number of Terminations | 44Terminations | |
Max Power Dissipation | 1W | |
Terminal Position | QUAD | |
Terminal Form | J BEND | |
Peak Reflow Temperature (Cel) | 245 | |
Supply Voltage | 5V | |
Terminal Pitch | 1.27mm | |
Frequency | 60MHz | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Base Part Number | AT89C51RC2 | |
Supply Voltage-Max (Vsup) | 5.5V | |
Supply Voltage-Min (Vsup) | 2.7V |
Interface | SPI, UART, USART | |
Memory Size | 32kB | |
Oscillator Type | External | |
Speed | 40 MHz | |
RAM Size | 1.25K x 8 | |
Voltage - Supply (Vcc/Vdd) | 2.7V~5.5V | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER | |
Core Processor | 80C51 | |
Peripherals | POR, PWM, WDT | |
Program Memory Type | FLASH | |
Core Size | 8-Bit | |
Program Memory Size | 32KB 32K x 8 | |
Connectivity | SPI, UART/USART | |
Bit Size | 8 | |
Access Time | 60 μs | |
Has ADC | NO | |
DMA Channels | NO | |
Data Bus Width | 8b | |
PWM Channels | YES | |
DAC Channels | NO | |
Number of Timers/Counters | 3Timers/Counters | |
Address Bus Width | 16 | |
Core Architecture | 8051 | |
Length | 16.55mm | |
Height Seated (Max) | 4.57mm | |
REACH SVHC | No SVHC | |
Radiation Hardening | No | |
RoHS Status | ROHS3 Compliant | |
Lead Free | Lead Free |
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AT89C51RC2-SLSUM Documents
Download datasheets and manufacturer documentation for AT89C51RC2-SLSUM
- DatasheetsAT89C51RB2,RC2 AT89C51RC2-SLSUM-Microchip-datasheet-8239.pdf AT89C51RC2-SLSUM-Microchip-datasheet-21192182.pdf
- PCN PackagingShipping Tube 19/Sep/2018 Transfer to Microchip/Label/Pkg 5/Sep/2016
- PCN Design/SpecificationCopper Bonding Wire 19/Dec/2014 Marking Chgs 11/Jul/2017
- PCN Assembly/OriginAT8YYY 03/Aug/2018
- ConflictMineralStatementMicrochip-company-68.pdf
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