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AT91SAM9G25-CU Tech Specifications

Category Embedded - Microprocessors
Manufacturer Microchip
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 217-LFBGA
Number of Pins 217Pins
Memory Types FLASH, ROM
Number of I/Os 105I/Os
Watchdog Timers Yes
Operating Temperature -40°C~85°C TA
Packaging Tray
Series SAM9G
Published 2004
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 217Terminations
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1V
Terminal Pitch 0.8mm
Frequency 400MHz
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number AT91SAM9G25
Interface 2-Wire, EBI/EMI, Ethernet, I2C, IrDA, LIN, MMC, SPI, UART, USART, USB
Max Supply Voltage 1.1V
Min Supply Voltage 900mV
Memory Size 64kB
Oscillator Type Internal
RAM Size 32kB
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM926EJ-S
Peripherals DMA, POR, PWM, WDT
Bit Size 32
Has ADC YES
DMA Channels YES
Data Bus Width 32b
Number of Timers/Counters 6Timers/Counters
Core Architecture ARM
Voltage - I/O 1.8V 3.3V
Number of ADC Channels 12ADC Channels
Ethernet 10/100Mbps
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR2, SDRAM, SRAM
USB USB 2.0 (3)
Additional Interfaces EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
Number of PWM Channels 4PWM Channels
Number of USB Channels 1USB Channel
Height 900μm
Length 15.05mm
Width 15.05mm
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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