ATSAMG55J19B-MU Tech Specifications

Category Embedded - Microcontrollers
Manufacturer Microchip
Factory Lead Time 7 Weeks
Mounting Type Surface Mount
Package / Case 64-VFQFN Exposed Pad
Surface Mount YES
Data Converters A/D 8x12b
Number of I/Os 48I/Os
Operating Temperature -40°C~85°C TA
Packaging Tray
Series SAM G55
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64Terminations
Terminal Finish Matte Tin (Sn)
Terminal Position QUAD
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 0.4mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number ATSAMG55J
JESD-30 Code S-XQCC-N64
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 1.62V
Oscillator Type Internal
Speed 120MHz
RAM Size 176K x 8
Voltage - Supply (Vcc/Vdd) 1.62V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM® Cortex®-M4
Peripherals DMA, I2S, POR, PWM, WDT
Clock Frequency 20MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 512KB 512K x 8
Connectivity I2C, SPI, UART/USART, USB
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels NO
DAC Channels NO
Length 7.5mm
Height Seated (Max) 0.9mm
Width 7.5mm
RoHS Status ROHS3 Compliant
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