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- LE57D122BTC
IN STOCK
: 44
Min. : 1
Mult. : 1




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LE57D122BTC Tech Specifications
Category | Interface - Telecom | |
Manufacturer | Microchip | |
Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) | |
Factory Lead Time | 10 Weeks | |
Mount | Surface Mount | |
Mounting Type | Surface Mount | |
Package / Case | 44-TQFP Exposed Pad | |
Usage Level | Industrial grade | |
Operating Temperature | -40°C~85°C | |
Packaging | Tray | |
JESD-609 Code | e3 | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Number of Terminations | 44Terminations | |
Terminal Finish | Matte Tin (Sn) |
Voltage - Supply | 4.75V~5.25V | |
Terminal Position | QUAD | |
Terminal Form | GULL WING | |
Supply Voltage | 5V | |
Terminal Pitch | 0.8mm | |
JESD-30 Code | S-PQFP-G44 | |
Function | Subscriber Line Interface Concept (SLIC) | |
Qualification Status | Not Qualified | |
Operating Supply Voltage | 5V | |
Interface | 2-Wire | |
Number of Circuits | 2Circuits | |
Operating Supply Current | 9.3mA | |
Length | 10mm | |
Width | 10mm | |
RoHS Status | ROHS3 Compliant |
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LE57D122BTC Documents
Download datasheets and manufacturer documentation for LE57D122BTC
- DatasheetsLe5712
- PCN Design/SpecificationMarking Change 05/Apr/2019
- PCN PackagingPacking Changes 07/Jul/2019
- PCN OtherMult Devices 06/May/2019
- PCN Part NumberPart Number Change 05/Apr/2019
- PCN Assembly/OriginBond Wire 08/Nov/2019
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