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- LE58QL021BVC
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LE58QL021BVC Tech Specifications
Category | Interface - Telecom | |
Manufacturer | Microchip | |
Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) | |
Factory Lead Time | 7 Weeks | |
Contact Plating | Tin | |
Mount | Surface Mount | |
Mounting Type | Surface Mount | |
Package / Case | 44-TQFP | |
Number of Pins | 44Pins | |
Supplier Device Package | 44-TQFP (10x10) | |
Usage Level | Industrial grade | |
Operating Temperature | -40°C~85°C | |
Packaging | Tray |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Max Operating Temperature | 85°C | |
Min Operating Temperature | -40°C | |
Voltage - Supply | 3.3V | |
Function | Subscriber Line Interface Concept (SLIC) | |
Interface | PCM | |
Number of Circuits | 4Circuits | |
Max Supply Voltage | 5V | |
Min Supply Voltage | 3.3V | |
Radiation Hardening | No | |
RoHS Status | ROHS3 Compliant | |
Lead Free | Lead Free |
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LE58QL021BVC Documents
Download datasheets and manufacturer documentation for LE58QL021BVC
- DatasheetsLe58QL02/021/031
- PCN OtherMultiple Changes 05/Apr/2019
- PCN Design/SpecificationMarking Change 05/Apr/2019
- PCN PackagingPacking Changes 07/Jul/2019
- PCN Part NumberPart Number Change 05/Apr/2019
- PCN Assembly/OriginBond Wire 08/Nov/2019
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