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LE88276DLC Tech Specifications
| Category | Interface - Telecom | |
| Manufacturer | Microchip | |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) | |
| Factory Lead Time | 10 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 80-LQFP | |
| Number of Pins | 80Pins | |
| Supplier Device Package | 80-eLQFP | |
| Weight | 639.990485mg | |
| Packaging | Tray |
| Published | 2008 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Voltage - Supply | 4.75V~35V | |
| Function | Telecom Circuit | |
| Number of Channels | 2Channels | |
| Interface | PCM | |
| Number of Circuits | 2Circuits | |
| Max Supply Voltage | 35V | |
| Min Supply Voltage | 4.75V | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
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LE88276DLC Documents
Download datasheets and manufacturer documentation for LE88276DLC
- PCN OtherMultiple Changes 05/Apr/2019
- PCN Design/SpecificationMarking Change 05/Apr/2019
- PCN PackagingPacking Changes 07/Jul/2019
- PCN Part NumberPart Number Change 05/Apr/2019
- PCN Assembly/OriginBond Wire 08/Nov/2019
- DatasheetsLe88276 Brief LE88276DLC-Microsemi-datasheet-13692967.pdf
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