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M2S005S-1FGG484T2 Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Microchip
Package / Case BGA-484
Supplier Device Package 484-FPBGA (23x23)
Shipping Restrictions This product may require additional documentation to export from the United States.
RoHS Details
Mounting Styles SMD/SMT
Core ARM Cortex M3
Maximum Clock Frequency 166 MHz
L1 Cache Instruction Memory -
L1 Cache Data Memory -
Data RAM Size 64 kB
Number of Logic Elements 6060 LELogic Element
Number of I/Os 209 I/OI/O
Minimum Operating Temperature 0 C
Maximum Operating Temperature + 85 C
Distributed RAM 191 kbit
Moisture Sensitive Yes
Number of Logic Array Blocks - LABs 505 LABLogic Array Blocks - LAB
Factory Pack QuantityFactory Pack Quantity 60
Typical Operating Supply Voltage 1.2000 V
Product Status Active
Mfr Microchip Technology
Base Product Number M2S005
Package Tray
Package Description ,
Reflow Temperature-Max (s) 40
Rohs Code Yes
Manufacturer Part Number M2S005S-1FGG484T2
Part Life Cycle Code Active
Ihs Manufacturer MICROSEMI CORP
Risk Rank 5.81
Packaging Tray
Series SmartFusion2
Operating Temperature 0 to 85 °C
JESD-609 Code e1
Pbfree Code Yes
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Peak Reflow Temperature (Cel) 250
Reach Compliance Code compliant
Operating Supply Voltage 1.2 V
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR
Program Memory Size 128 kB
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Speed Grade 1
Primary Attributes FPGA - 5K Logic Modules
Number of Cores 1 CoreCore
Flash Size 128KB
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