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M2S010S-TQG144I Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Microchip
Package / Case TQFP-144
Supplier Device Package 144-TQFP (20x20)
Shipping Restrictions This product may require additional documentation to export from the United States.
Mounting Styles SMD/SMT
Core ARM Cortex M3
Maximum Clock Frequency 166 MHz
L1 Cache Instruction Memory -
L1 Cache Data Memory -
Data RAM Size 64 kB
Number of Logic Elements 12084 LELogic Element
Number of I/Os 84 I/OI/O
Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 100 C
Distributed RAM 400 kbit
Number of Logic Array Blocks - LABs 1007 LABLogic Array Blocks - LAB
Factory Pack QuantityFactory Pack Quantity 60
Package Tray
Base Product Number M2S010
Mfr Microchip Technology
Product Status Active
Packaging Tray
Series SmartFusion2
Operating Temperature -40°C ~ 100°C (TJ)
Operating Supply Voltage 1.2 V
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals -
Program Memory Size 256 kB
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Architecture MCU, FPGA
Primary Attributes FPGA - 10K Logic Modules
Number of Cores 1 CoreCore
Flash Size 256KB
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