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M2S025T-FCSG325 Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Microchip
Lifecycle Status Production (Last Updated: 2 months ago)
Package / Case 325-TFBGA, FCBGA
Surface Mount YES
Supplier Device Package 325-FCBGA (11x11)
Number of Terminals 325Terminals
Shipping Restrictions This product may require additional documentation to export from the United States.
RoHS Details
Core ARM Cortex M3
Maximum Clock Frequency 166 MHz
L1 Cache Instruction Memory -
L1 Cache Data Memory -
Data RAM Size 64 kB
Number of Logic Elements 27696 LELogic Element
Moisture Sensitive Yes
Number of Logic Array Blocks - LABs 2308 LABLogic Array Blocks - LAB
Factory Pack QuantityFactory Pack Quantity 176
Unit Weight 0.111027 oz
Typical Operating Supply Voltage 2.5, 3.3 V
MSL MSL 3 - 168 hours
Number of I/Os 180I/Os
Package Tray
Base Product Number M2S025
Mfr Microchip Technology
Product Status Active
Package Description FBGA-325
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Moisture Sensitivity Levels 3
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA325,21X21,20
Supply Voltage-Nom 1.2 V
Reflow Temperature-Max (s) 40
Supply Voltage-Min 1.14 V
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number M2S025T-FCSG325
Package Code TFBGA
Package Shape SQUARE
Part Life Cycle Code Active
Ihs Manufacturer MICROSEMI CORP
Supply Voltage-Max 1.26 V
Risk Rank 5.78
Packaging Tray
Series SmartFusion2
Operating Temperature 0 to 85 °C
JESD-609 Code e1
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Terminal Pitch 0.5 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B325
Number of Outputs 180Outputs
Qualification Status Not Qualified
Power Supplies 1.2 V
Temperature Grade OTHER
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Program Memory Size 256 kB
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 180Inputs
Seated Height-Max 1.01 mm
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits 592Kbit
Speed Grade STD
Primary Attributes FPGA - 25K Logic Modules
Number of Logic Cells 27696Logic Cells
Number of Cores 1 CoreCore
Flash Size 256KB
Width 11 mm
Length 11 mm
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