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M2S050TS-1FCS325 Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Microchip
Lifecycle Status Production (Last Updated: 2 months ago)
Package / Case FCBGA-325
Supplier Device Package 325-FCBGA (11x11)
Shipping Restrictions This product may require additional documentation to export from the United States.
RoHS N
Mounting Styles SMD/SMT
Core ARM Cortex M3
Maximum Clock Frequency 166 MHz
L1 Cache Instruction Memory -
L1 Cache Data Memory -
Data RAM Size 64 kB
Number of Logic Elements 56340 LELogic Element
Moisture Sensitive Yes
Number of Logic Array Blocks - LABs 4695 LABLogic Array Blocks - LAB
Factory Pack QuantityFactory Pack Quantity 176
Number of I/Os 200I/Os
Package Tray
Base Product Number M2S050
Mfr Microchip Technology
Product Status Active
Packaging Tray
Series SmartFusion2
Operating Temperature 0°C ~ 85°C (TJ)
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Program Memory Size 256 kB
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Architecture MCU, FPGA
Primary Attributes FPGA - 50K Logic Modules
Number of Cores 1 CoreCore
Flash Size 256KB
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