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M2S090TS-1FGG484T2 Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Microchip
Package / Case BGA-484
Supplier Device Package 484-FPBGA (23x23)
Mounting Styles SMD/SMT
Core ARM Cortex M3
Maximum Clock Frequency 166 MHz
L1 Cache Instruction Memory -
L1 Cache Data Memory -
Data RAM Size 64 kB
Number of Logic Elements 86316 LELogic Element
Number of I/Os 267 I/OI/O
Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 125 C
Distributed RAM 2074 kbit
Number of Logic Array Blocks - LABs 7193 LABLogic Array Blocks - LAB
Factory Pack QuantityFactory Pack Quantity 60
Unit Weight 2.110353 oz
Package Tray
Base Product Number M2S090
Mfr Microchip Technology
Product Status Active
Packaging Tray
Series SmartFusion2
Operating Temperature -40°C ~ 125°C (TJ)
Operating Supply Voltage 1.2 V
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Program Memory Size 512 kB
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Architecture MCU, FPGA
Speed Grade 1
Primary Attributes FPGA - 90K Logic Modules
Number of Cores 1 CoreCore
Flash Size 512KB
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