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M2S150TS-FCVG484 Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Microchip
Package / Case 484-BFBGA
Supplier Device Package 484-FBGA (19x19)
Shipping Restrictions This product may require additional documentation to export from the United States.
RoHS Details
Core ARM Cortex M3
Maximum Clock Frequency 166 MHz
L1 Cache Instruction Memory -
L1 Cache Data Memory -
Data RAM Size 64 kB
Number of Logic Elements 146124 LELogic Element
Moisture Sensitive Yes
Number of Logic Array Blocks - LABs 12177 LABLogic Array Blocks - LAB
Factory Pack QuantityFactory Pack Quantity 84
Number of I/Os 273I/Os
Package Tray
Base Product Number M2S150
Mfr Microchip Technology
Product Status Active
Packaging Tray
Series SmartFusion2
Operating Temperature 0°C ~ 85°C (TJ)
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Program Memory Size 512 kB
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Architecture MCU, FPGA
Primary Attributes FPGA - 150K Logic Modules
Number of Cores 1 CoreCore
Flash Size 512KB
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