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- MCP23S08T-E/ML
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MCP23S08T-E/ML Tech Specifications
| Category | Interface - I/O Expanders | |
| Manufacturer | Microchip | |
| Factory Lead Time | 8 Weeks | |
| Contact Plating | Tin | |
| Mounting Type | Surface Mount | |
| Package / Case | 20-VFQFN Exposed Pad | |
| Surface Mount | YES | |
| Number of I/Os | 8I/Os | |
| Operating Temperature | -40°C~125°C | |
| Packaging | Tape & Reel (TR) | |
| Published | 2007 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 20Terminations | |
| ECCN Code | EAR99 | |
| Voltage - Supply | 1.8V~5.5V | |
| Terminal Position | QUAD | |
| Terminal Form | NO LEAD | |
| Peak Reflow Temperature (Cel) | 260 | |
| Supply Voltage | 5V |
| Terminal Pitch | 0.5mm | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Base Part Number | MCP23S08 | |
| Pin Count | 20 | |
| JESD-30 Code | R-PQCC-N20 | |
| Qualification Status | Not Qualified | |
| Output Type | Push-Pull | |
| Operating Supply Voltage | 5.5V | |
| Power Supplies | 5V | |
| Interface | SPI | |
| Number of Ports | 1Port | |
| Power Dissipation | 700mW | |
| Number of Bits | 8Bits | |
| Clock Frequency | 10MHz | |
| Interrupt Output | Yes | |
| Current - Output Source/Sink | 25mA | |
| Features | POR | |
| Length | 4mm | |
| Height Seated (Max) | 1mm | |
| Width | 4mm | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
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MCP23S08T-E/ML Documents
Download datasheets and manufacturer documentation for MCP23S08T-E/ML
- DatasheetsML-Microchip-datasheet-608140.pdf ML-Microchip-datasheet-139544.pdf MCP23008, MCP23S08 ML-Microchip-datasheet-204.pdf
- PCN Design/SpecificationLeadFrame/Bond Wire Material Update 31/Aug/2017
- PCN PackagingPacking Changes 10/Oct/2016
- ConflictMineralStatementMicrochip-company-68.pdf
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