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MT8870DS1 Tech Specifications
Category | Interface - Telecom | |
Manufacturer | Microchip | |
Factory Lead Time | 8 Weeks | |
Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) | |
Package / Case | 18-SOIC (0.295, 7.50mm Width) | |
Mounting Type | Surface Mount | |
Mount | Surface Mount | |
Number of Pins | 18Pins | |
Packaging | Tube | |
Operating Temperature | -40°C~85°C | |
JESD-609 Code | e3 | |
Pbfree Code | yes | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Number of Terminations | 18Terminations | |
Terminal Finish | MATTE TIN | |
Max Power Dissipation | 500mW | |
Voltage - Supply | 4.75V~5.25V |
Terminal Position | DUAL | |
Terminal Form | GULL WING | |
Peak Reflow Temperature (Cel) | 260 | |
Supply Voltage | 5V | |
Frequency | 3.58MHz | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Function | DTMF Receiver | |
Operating Supply Voltage | 5V | |
Power Supplies | 5V | |
Number of Circuits | 1Circuit | |
Operating Supply Current | 3mA | |
Nominal Supply Current | 3mA | |
Logic Function | Receiver | |
Telecom IC Type | DTMF SIGNALING CIRCUIT | |
Width | 7.5mm | |
Height Seated (Max) | 2.65mm | |
RoHS Status | ROHS3 Compliant | |
Radiation Hardening | No |
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MT8870DS1 Documents
Download datasheets and manufacturer documentation for MT8870DS1
- PCN OtherMultiple Changes 05/Apr/2019
- PCN Design/SpecificationMarking Change 05/Apr/2019
- PCN PackagingPacking Changes 07/Jul/2019
- DatasheetsMT8870D(-1)
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