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MT90869AG2 Tech Specifications
Category | Interface - Telecom | |
Manufacturer | Microchip | |
Factory Lead Time | 8 Weeks | |
Mount | Surface Mount | |
Mounting Type | Surface Mount | |
Package / Case | 272-BGA | |
Number of Pins | 272Pins | |
Operating Temperature | -40°C~85°C | |
Packaging | Tray | |
Published | 2010 | |
JESD-609 Code | e1 | |
Pbfree Code | yes | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Number of Terminations | 272Terminations | |
Terminal Finish | TIN SILVER COPPER | |
Voltage - Supply | 3V~3.6V |
Terminal Position | BOTTOM | |
Terminal Form | BALL | |
Peak Reflow Temperature (Cel) | 250 | |
Supply Voltage | 1.8V | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Function | Switch | |
Number of Circuits | 1Circuit | |
Operating Supply Current | 160mA | |
Number of Ports | 64Ports | |
Supply Current-Max | 200mA | |
Length | 27mm | |
Height Seated (Max) | 2.32mm | |
Width | 27mm | |
Radiation Hardening | No | |
RoHS Status | ROHS3 Compliant | |
Lead Free | Lead Free |
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MT90869AG2 Documents
Download datasheets and manufacturer documentation for MT90869AG2
- DatasheetsMT90869
- PCN OtherMultiple Changes 05/Apr/2019
- PCN Design/SpecificationMarking Change 05/Apr/2019
- PCN PackagingPacking Changes 07/Jul/2019
- PCN Assembly/OriginMult Dev Halogen-Free Substrate 21/Feb/2017
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